Shrinking silicon transistors has become a game of diminishing returns, where power leakage and thermal management problems threaten to stall chip performance. Nexstrom, incubated by Xora Innovation, aims to bypass these constraints by integrating transition-metal dichalcogenides (TMDs)—materials only a few atoms thick—into the existing manufacturing flow. While industry giants like TSMC and Intel are also exploring 2D materials, Nexstrom is positioning its North Star equipment as a bridge to mass production.
Chief scientist Lance Li, who previously led post-silicon research at TSMC, notes that the industry transition from lab-scale samples to high-quality industrial output remains a significant hurdle. Nexstrom is currently scaling its growth process from 2-inch samples to full 300mm wafers. The company plans to use the new capital to refine process control and measurement capabilities, aiming for commercial readiness between 2030 and 2035. Rather than competing directly with established foundries, Nexstrom intends to license its technology or partner with major players to integrate these materials into future chip architectures.

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